In this WP, the SW will be developed and the mechanical box will be designed and manufactured. Once the electronic units and sub-units have been designed, tested and validated, the goal will be to integrate the complete instrument (both mechanically and electronically) and validate its functionality and performance.

Objectives

Develop the SW, design and manufacture the mechanical enclosure, integrate the full breadboard instrument (both mechanically and electronically) and validate its functionalities and performance against the requirements defined in WP1.

 Lead / Participants

CSIC, TASE

Description

Task 3.1 Development of the SW (lead: CSIC)

CSIC: Based on the requirements and algorithms defined in Tasks 1.2, 1.3 and 1.4, implement the software on board the DPU to control the whole instrument and acquire and process the data. The steps necessaries for the SW development are: to collect requirements description, analysis and design of the software architecture, implementation of the code, description of the test procedures and validation campaign.

Task 3.2 EGSE development (lead: CSIC)

CSIC: Design, implement and manufacturing the EGSE for communicating with the DPU with its software, simulating a spacecraft/lander in terms of telecommands and telemetries. The EGSE will be used for both the HW and SW validation campaigns.

Task 3.3 Assembly, integration and test of the instrument electronics (lead: CSIC)

CSIC: Based on the sub-units and units designed in WP 2, assemble, integrate and test the whole instrument electronics. Assessment of the instrument against the requirements set in Tasks 1.2 and 1.3. Given the very sensitive analogue front end, special care will be given to EMI/EMC aspect of the design.

Task 3.4 EMC test of the integrated instrument (lead TASE, participant: CSIC)

TASE: To carry out the EMC test campaign of the integrated instrument.
CSIC: Support for SW and EGSE.